11 results
Understanding the Impact of Porosity and Pore Structure in Ultra Low Dielectric Constant Organosilicate Glasses
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1428 / 2012
- Published online by Cambridge University Press:
- 30 July 2012, mrss12-1428-c01-10
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- 2012
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Precursor design and engineering for low-temperature deposition of gate dielectrics for thin film transistors
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1287 / 2011
- Published online by Cambridge University Press:
- 22 September 2011, mrsf10-1287-f02-06
- Print publication:
- 2011
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Formation of Porous Organosilicate Glasses Produced by PECVD and UV Treatment
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- Journal:
- MRS Online Proceedings Library Archive / Volume 990 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0990-B01-04
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- 2007
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Routes to the Formation of Air Gap Structures Using PECVD
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F10-02
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- 2006
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Impact of Pore Size and Morphology of Porous Organosilicate Glasses on Integrated Circuit Manufacturing
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- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F01-02
- Print publication:
- 2006
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Plasma Enhanced Chemical Vapor Deposition of Porous Organosilicate Glass ILD Films With k ≤ 2.4.
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- Journal:
- MRS Online Proceedings Library Archive / Volume 766 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, E7.4
- Print publication:
- 2003
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Evaluation of Copper Penetration in Low-κ Polymer Dielectrics by Bias-Temperature Stress
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- Journal:
- MRS Online Proceedings Library Archive / Volume 565 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 173
- Print publication:
- 1999
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Evaluation of Copper Penetration in Low-κ Polymer Dielectrics by Bias-Temperature Stress
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- Journal:
- MRS Online Proceedings Library Archive / Volume 564 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 535
- Print publication:
- 1999
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Electrical Reliability of Cu and Low-K Dielectric Integration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 511 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 317
- Print publication:
- 1998
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Poly(Arylene Ethers) as Low Dielectric Constant Materials for ULSI Interconnect Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 443 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 171
- Print publication:
- 1996
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MOCVD-TiN Barrier Layers for ULSI Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 260 / 1992
- Published online by Cambridge University Press:
- 25 February 2011, 99
- Print publication:
- 1992
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